Investigating the Effects of Temperature, Paste Height and Time on the Rolling of Solder Paste

Abstract

Based on application, it was found that the rheological properties of the solder paste play an important role in the print performance. Temperature-dependent rheological behaviour of the lead-free solder paste and flux medium used for flip-chip assembly applications were studied. Two commercially available lead-free solder pastes P1 (LF318) and P2 (LF328) prepared from fluxes F1 and F2 were used. The temperatures under investigation were 15˚C, 25˚C, and 35˚C. All the results recorded were put into the Gauge calculator. The snap-off height variable and the condition of the printing equipment were used to determine the print height. Slump test was used to determine the slumping behaviour at room temperature and during reflow. Results show that the properties of solder paste are immensely affected by paste heights, high temperature variations, time and humidity.

Keywords: Surface Mount Technology (SMT), Printed Circuit Board (PCB) Assembly, Slump Test, Reflow Soldering, Solder Paste.

DOI: 10.7176/ISDE/11-1-05

Publication date: February 29^th 2020